Printed Circuit Board Fabrication Products

MicroClean™ EC-2 RDZ-1604

RD Chemical Company — Sat, 30 Jan 2010 03:51:22 +0000

Acid Copper Spray Cleaner

MicroClean™ EC-2 (RDZ-1604) is an acid cleaner designed to thoroughly clean copper at low concentrations. MicroClean™ EC-2 (RDZ-1604) will not lift or soften dry film or screen resists. MicroClean™ EC-2 (RDZ-1604) may be used as a precleaner before microetch or as a stand alone-cleaner before photoresist. MicroClean™ EC-2 is a true cleaner, and removes soils and Copper oxides only, and no base metal. MicroClean™ EC-2 (RDZ-1604) may be used to safely clean DT and RTF Copper foils.

MAKE-UP:
MicroClean™ EC-2 (RDZ-1604) is used at 5% to 10% by volume. Higher concentrations or temperatures are required for faster cleaning.

OPERATION:
Use MicroClean™ EC-2 (RDZ-1604) at a temperature range of 115° - 130° F for 1-2 minutes.

After use, rinse boards thoroughly, preferably in an opposed-offset spray rinse, and process immediately.

EQUIPMENT:
Use a plastic tank that can withstand application temperature: polypropylene, fiberglass or reinforced polyethylene. Stainless Steel may be used only if makeup water is chloride free.

SAFETY:

MicroClean™ EC-2 (RDZ-1604) is a mildly hazardous, acidic product, however, care should be taken when handling. Eye protection is required: goggles, a full-face shield, or other protection that will completely prevent contact with eyes is recommended. Plastic or rubber safety gloves should be worn. Avoid contact with skin. Consult Material Safety Data Sheet for further information.

DISPOSAL:
Spent cleaning solution may contain large amounts of dissolved copper. Prior to disposal, the solution may require neutralization and precipitation of the copper or the solution may need to be disposed of at an approved hazardous waste disposal site. MicroClean™ EC-2 (RDZ-1604) contains some chelates. Dispose of in accordance with Federal, State, and Local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

MicroClean™ EC-2 (RDZ-1604) is supplied in 15 and 55 gallon drums.

Determination of Concentration of MicroClean™ EC-2 (RDZ-1604)

Equipment Required:

1 (50 ml) Buret
1 250 ml Flask for titration
1 25 ml pipet
Magnetic Stirrer (optional)

Reagents required:

1.OO N NaOH (Sodium Hydroxide)
Phenolphthalein indicator solution

Procedure:

1. Pipette 25-ml sample of bath into flask.
2. Dilute with water (deionized preferred) to convenient volume.
3. Add a few drops of Phenolphthalein indicator.
4. Titrate with 1.00 N NaOH to first permanent pink color. Note mls 1.00 N NaOH used.

% MicroClean™ EC-2 (RDZ-1604) by volume = mls 1.00N NaOH X 0.61

RD Chemical Company makes these recommendations in good faith, based on laboratory and field testing. Ultimate responsibility for propriety of use, however, must rest with the purchaser and user. RD Chemical Company recommends thorough testing of its products, before use.

MicroClean™ EC-1 RDZ-1603

RD Chemical Company — Sat, 30 Jan 2010 03:50:50 +0000

Copper Cleaner/Oxide and Chromate Remover

MicroClean™ EC-1 (RDZ-1603) is a powerful low foam cleaner/nanoetch for removing finger prints, chromate, and oxide residues from copper prior to photoresist lamination. Replenishment is based on consumption of the acidity in the product. MicroClean™ EC-1 (RDZ-1603) baths may be replenished, until the dissolved Copper level gets so high that the cleaner etches the substrate excessively.

In most cases, the acceptable maximum level of dissolved metal will be 2000 PPM. If solution dragout is significant, this level may never be reached, so that it may be possible to run with only bath replenishment, based on analysis of the bath acidity. Increasing bath temperature will increase metal removal rate.

MAKE-UP:
Make up MicroClean™ EC-1 (RDZ-1603) at 15 ± 5% by volume in tap or deionized water. Higher make up levels give greater anti-tarnish properties.

OPERATION:
Operate at 75-120° F, for 30-120 seconds, depending on temperature. If used in spray, heat to at least 80° F before turning on pumps, otherwise cleaner may foam excessively. Analyze periodically (every 4 hours initially, later may be once per shift). Keep concentration of product at 15 ± 5%. Do not exceed operating temperature of 130° F. Optimum temperature range is 80-90° F. Control by titration, see reverse for procedure.

EQUIPMENT:
Use plastic or titanium. Quartz, Teflon or Titanium heaters may be used. DO NOT use Stainless Steel equipment.

SAFETY:

Use caution, MicroClean™ EC-1 (RDZ-1603) contains Hydrochloric Acid. Rinse skin or eyes if contact is made. Consult Material Safety Data Sheet for further information.

DISPOSAL:
Neutralize and precipitate any dissolved heavy metals. Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

MicroClean™ EC-1 (RDZ-1603) is available in 15 & 55 gallon poly drums.

A. Procedure for Determining Concentration of MicroClean™ EC-1 (RDZ-1603)

Equipment Required:

1 (50 ml) Buret
1 Titration Flask
1 25 ml pipet
Magnetic Stirrer (optional)

Reagents required:

1.OO N NaOH (Sodium Hydroxide)
Phenolphthalein indicator solution

Procedure:

1. Put 25 ml sample of cleaner bath into titration flask.
2. Add few drops Phenolphthalein indicator solution to flask.
3. Titrate with 1.00N NaOH to first permanent trace of red. Note mls required.

Percent by Volume MicroClean™ EC-1 (RDZ-1603) = mls 1.00N NaOH X 0.966

B. Procedures for Determining Dissolved Copper In MicroClean™ EC-1 (RDZ-1603)

Copper may be determined by Atomic Absorbtion, Colorimetrically, or by Iodometric Titration. Colorimetric method is available on request, and will need to be customized for the particular Colorimeter.

Iodometric method for determining Dissolved Copper Content:

1. Take 100 ml sample of cleaner bath
2. Add 5 mls con. HCl and 3-5 grams of Potassium Iodide
3. Titrate to near colorless with 0.100N Sodium Thiosulfate, add few mls Starch indicator, continue titrating until colorless.

PPM Dissolved Copper = mls 0.100N Sodium Thiosulfate X 63.5

MicroClean™ CuLX RD-68

RD Chemical Company — Sat, 30 Jan 2010 03:50:08 +0000

An Alkaline Soak Cleaner For cleaning Copper & Iron Alloy Foils

MicroClean™ CuLX (RD-68) is a "micro-cleaner" that is designed to remove extremely tenacious soils from copper, iron, iron-nickel and iron-nickel-chrome alloys. MicroClean™ CuLX (RD-68) was created to meet the needs of the Chemical Milling Industry, which is frequently faced with removing the baked-on organic compounds such as those found on sheets of Alloy 42 and stainless steel as they are received or, after stripping baked-on photoresist. MicroClean™ CuLX (RD-68) has been used very successfully as a pre-clean for printed circuit boards before photoresist application or prior to oxide application. To achieve the best results in cleaning prior to photoresist application, follow MicroClean™ CuLX (RD-68) with MicroClean™ NE (RD-15).

MicroClean™ CuLX (RD-68) has also been used successfully in ChemBond oxide preclean line. When used in the oxide preclean, it is followed with MicroClean™ NE (RD-15) acid cleaner, or with Unietch (RD-84) if a microetch is desired.

MAKE-UP:
Use at 25 - 33% by volume, at 130º - 180º F. Cleaning time will vary from one (1) to five (5) minutes, depending upon temperature and tenacity of the soils. Chemical Milling foils require higher temperatures and longer processing times. Printed Circuit Board foils are more easily cleaned.

OPERATION:
For use in spray operations. MicroClean™ CuLX (RD-68) rinses freely and completely with no residues. Maintain at recommended concentration by titration. Keep dissolved Copper at less than 2000 ppm.

EQUIPMENT:
Tanks should be constructed of polypropylene, PVC, or stainless steel. Heaters should be quartz, Teflon, Titanium, or stainless steel.

SAFETY:

MicroClean™ CuLX (RD-68) contains caustic potash (lye) and can cause severe burns to skin and eyes. Wearing safety goggles or a full-face shield is MANDATORY. Also wear gloves and protective clothing. Consult Material Safety Data Sheet for further information.

DISPOSAL:
Completely biodegradable and containing no solvents, MicroClean™ CuLX (RD-68) may be disposed of into most sanitary sewage systems after any heavy metals picked up during use are removed and pH adjusted. Check with your local sanitary district regulators for guidance. Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

A free-flowing low foam liquid, MicroClean™ CuLX (RD-68) is available in 55 gallon poly drums.

MicroClean™ CuL RD-19

RD Chemical Company — Sat, 30 Jan 2010 03:48:51 +0000

An Alkaline Spray Cleaner For cleaning Copper & Iron Alloy Foils

MicroClean™ CuL (RD-19) is a "micro-cleaner" that is designed to remove extremely tenacious soils from copper, iron, iron-nickel and iron-nickel-chrome alloys. MicroClean™ CuL (RD-19) was created to meet the needs of the Chemical Milling Industry, which is frequently faced with removing the baked-on organic compounds such as those found on sheets of Alloy 42 and stainless steel as they are received or, after stripping baked-on photoresist. MicroClean™ CuL (RD-19) has been used very successfully as a pre-clean for printed circuit boards before photoresist application or prior to oxide application. To achieve the best results in cleaning prior to photoresist application, follow MicroClean™ CuL (RD-19) with MicroClean™ NE (RD-15).

MicroClean™ CuL (RD-19) has also been used successfully in ChemBond oxide preclean line. When used in the oxide preclean, it is followed with MicroClean™ NE (RD-15) acid cleaner, or with Unietch (RD-84) if a microetch is desired.

MAKE-UP:
Use at 25 - 33% by volume, at 130° - 180° F. Cleaning time will vary from one (1) to five (5) minutes, depending upon temperature and tenacity of the soils. Chemical Milling foils require higher temperatures and longer processing times. Printed Circuit Board foils are more easily cleaned.

OPERATION:
For use in spray operations. MicroClean™ CuL (RD-19) rinses freely and completely with no residues. Maintain at recommended concentration by titration. Keep dissolved Copper at less than 2000 ppm.

EQUIPMENT:
Spray equipment should be constructed of polypropylene, PVC, or stainless steel. Heaters should be quartz, Teflon, Titanium, or stainless steel.

SAFETY:

MicroClean™ CuL (RD-19) contains caustic potash (lye) and can cause severe burns to skin and eyes. Wearing safety goggles or a full-face shield is MANDATORY. Also wear gloves and protective clothing. Consult Material Safety Data Sheet for further information.

DISPOSAL: Completely biodegradable and containing no solvents, MicroClean™ CuL (RD-19) may be disposed of into most sanitary sewage systems after any heavy metals picked up during use are removed and pH adjusted. Check with your local sanitary district regulators for guidance. Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

A free-flowing low foam liquid, MicroClean™ CuL (RD-19) is available in 55 gallon poly drums.

MaskStrip RD-85

RD Chemical Company — Sat, 30 Jan 2010 03:47:57 +0000

High Capacity Solder Mask Stripper

MaskStrip (RD-85) MaskStrip (RD-85) is designed to remove uncured UV and thermal solder mask from printed circuit boards and screens. It contains no methylene chloride, other chlorinated solvents or aromatic organic compounds.

MaskStrip (RD-85) is fully water rinsable and does not affect laminate or metal plating. With proper dilution, rinse waters may not require special treatment. MaskStrip (RD-85) will not attack plated metals, so spent solutions will have no heavy metal content. Screening frames and fabrics will not be harmed with this process.

MAKE-UP:
MaskStrip (RD-85) is used at full strength and at room temperature.

OPERATION:
Circuit boards and screening equipment should be immersed from 5 minutes to one hour, depending on the thickness, type of mask and age of deposit. Some solder mask formulations will dissolve completely. Others may require additional scrubbing or spray rinse to completely remove all material. Water rinse with spray or agitated immersion.

Optimum life and effectiveness is achieved by using a two tank system where the second tank of MaskStrip (RD-85) functions as a clean rinse before the final water rinse. When the first tank becomes heavily loaded it is replaced by the contents of the second tank, and the second tank is refilled with fresh MaskStrip (RD-85).

Do not allow water to contaminate MaskStrip (RD-85), as this will shorten bath life significantly.

EQUIPMENT:
MaskStrip (RD-85) can be stored in polypropylene, polyethylene, or stainless steel. Tanks should be covered to keep out water spills.

SAFETY:

MaskStrip (RD-85) contains a non-aromatic solvent blend. Avoid contact with skin and eyes. Wear protective clothing, and avoid breathing vapors. Consult Material Safety Data Sheet for further information.

DISPOSAL:
Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

MaskStrip (RD-85) is available in 5 gallon pails and 55 gallon polyethylene drums.

In-Process Defoamer RD-36

RD Chemical Company — Sat, 30 Jan 2010 03:47:14 +0000

Non-Silicone: For use in Developers or other Spray Systems where Clean Rinsing is Essential

In-Process Defoamer (RD-36)is a fully organic non-Silicone water soluble defoamer that rinses readily and leaves no residue. It is odor free, and biodegradable. In-Process Defoamer (RD-36) will defoam any aqueous (water-based) or semi-aqueous system at any pH. It is ideal for defoaming semi-aqueous photoresist developers, strippers, or cleaners of any type.

MAKE-UP:
In-Process Defoamer (RD-36) is used at 100 to 5000 ppm. Try 1000 ppm to start. This is equivalent to 0.10 oz/gallon of solution.

OPERATION:
Use at 70° to 130° F. In-Process Defoamer (RD-36) permanently defoams. It will not be deactivated or be "used up" in solution.

EQUIPMENT:
In-Process Defoamer (RD-36) is compatible with all equipment materials.

SAFETY:

In-Process Defoamer (RD-36) is non-hazardous. Consult Material Safety Data Sheet for further information.

DISPOSAL:
In-Process Defoamer (RD-36) is biodegradable and in use concentrations do not have to be treated prior to disposal. Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

In-Process Defoamer is available in 5 gallon pails, 15 and 55 gallon drums.

HASL Pre-Cleaner SL RD-08

RD Chemical Company — Sat, 30 Jan 2010 03:46:38 +0000

An Alkaline Pre-HASL (or Alternative Finish) Cleaner

HASL Pre-Cleaner SL is a powerful, non-foaming, free rinsing, alkaline cleaner specifically designed to clean Copper prior to HASL or alternative finishes. It will remove solder mask developer scum, oven baked oxidation and residues, fingerprints, and oils. HASL Pre-Cleaner SL will not etch copper nor will it damage the soldermask because the cleaner contains a soldermask/organic substrate attack inhibitor.

HASL Pre-Cleaner SL can be used in conjunction with a light microetch, or acid cleaner. If an acid cleaner is used, MicroClean ZE (RD-10) is preferred. If a microetch is used, much lower levels of metal removal are fully acceptable, thus minimizing costs and reject rate.

Use of HASL Pre-Cleaner SL will profoundly reduce the requirement for a second pass through the HASL. This is because the potent cleaning agents in HASL Pre-Cleaner SL destroy organo-metallic compounds (such as insoluble Copper/soldermask compounds) present on the Copper surfaces.

MAKE-UP:
Make up at 25% by volume in tap or deionized water.

OPERATION:
May be used in spray or soak (immersion) application. Use at 100º-160º F, lower temperatures require longer contact times with cleaner. Increasing operating temperature 20° F doubles cleaning speed. Time required for cleaning is controlled by temperature, local water conditions, and choice of soldermask. Typical cleaning time should be 1-4 minutes.

EQUIPMENT:
Heaters may be Stainless Steel, Titanium, or Teflon coated. Flood type nozzles are preferred in spray equipment, although others may be used.

SAFETY:

HASL Pre-Cleaner SL is a mildly alkaline cleaner, and typically should have minimal effect if contact is made with skin. However, contact with eyes can be extremely irritating. RD Chemical Company recommends normal safety precautions for dealing with alkaline cleaners, and avoidance of contact with either concentrate or use solutions. Consult Material Safety Data Sheet for further information.

DISPOSAL:
Biodegradable, containing no solvents, HASL Pre-Cleaner SL is a chelated, mild alkaline cleaner. Spent solutions may contain heavy metals which will need to be removed before disposal. Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

HASL Pre-Cleaner SL is available in 5 gallon and 55 gallon poly drums.

HAL Flux RD-88

RD Chemical Company — Sat, 30 Jan 2010 03:45:58 +0000

Subtitle/Description

HAL Flux (RD-88) is the definitive flux for any type of Hot Air Leveled circuit board. This flux is especially recommended for dry film solder mask surface mount boards, the most difficult to level board known.

HAL Flux is based on organic acids, and does not contain hydrochloric or any other volatile acid, thus is safe on expensive equipment.

HAL Flux rinses easily and completely in cool water, without foaming. Preclean panels with HAL Cleaner (RD-14) immediately prior to flux application.

MAKE-UP:
HAL Flux is used as supplied.

OPERATION:
Cover panels completely with HAL Flux, then hot air level and rinse with cool water.

CONTROL:
Do not thin HAL Flux with alcohol or water. Use as supplied.

SAFETY:

HAL Flux contains organic acids. Avoid contact with eyes, skin and clothes. Wear protective clothing and goggles. Consult Material Safety Data Sheet for further information.

DISPOSAL:
May contain dissolved heavy metals after use, which must be removed before disposal. Dispose of in accordance with Federal, State and local regulations. Contact your RD Chemical representative for further information.

PACKAGING:

HAL Flux is available in 5 and 55 gallon poly containers.

HAL Flux EC2 RDZ-1643

RD Chemical Company — Sat, 30 Jan 2010 03:45:08 +0000

HAL Flux EC2 (RDZ-1643) is the definitive flux for any type of Hot Air Leveled circuit board. This flux is especially recommended for dry film solder mask surface mount boards, the most difficult type of board.

HAL Flux EC2 (RDZ-1643) is based on organic acids, and does not contain hydrazine salts (as do many HAL fluxes), thus is safe for both personnel, and expensive equipment.

HAL Flux EC2 (RDZ-1643) rinses easily and completely, and will help panels pass SIR/ionic contamination testing.

For ideal results, preclean panels with Pre-HAL Cleaner (RD-08) then with HAL Cleaner (RD-14) immediately prior to flux application.

MAKE-UP:
HAL Flux EC2 (RDZ-1643) is used as supplied.

OPERATION:
Cover panels completely with HAL Flux EC2 (RDZ-1643), then hot air level and rinse with cool water. First rinse should overflow, or be heated slightly to prevent foaming.

CONTROL:
Do not thin HAL Flux EC2 (RDZ-1643) with alcohol or water. Use as supplied.

SAFETY:

HAL Flux EC2 (RDZ-1643) contains organic acids. Avoid contact with eyes, skin and clothes. Wear protective clothing and goggles. Consult Material Safety Data Sheet for further information.

HAL Flux EC2 (RDZ-1643) is available in 5 and 55 gallon poly containers.

Tin & Solder Strippers

RD Chemical Company — Sat, 30 Jan 2010 03:32:46 +0000

Tin & Solder Strippers

ChemStrip (NXT RD-30)
Single step nitric base, fast, complete, long lived. Non-sludging, non-chelated.
ChemStrip TL (RD-52)
Inhibited peroxide based, for tip stripping. Very fast.