The Innerlayer Production Process
January 29, 2010
RD Chemical Company in Printed Circuit Board Fabrication, process
The Innerlayer Production Process
Alkaline Cleaner
Microetch or Acid Clean
Resist Application & Image
Develop
MicroClean™ CuL (RD-19) Spray, Powerful, Non-Tarnishing
MicroClean™ S (RD-17) Spray or Immersion, Low Metal Pickup
Developer HC (RD-41)
Highly Concentrated
MicroClean™ CuLX (RD-68) Immersion, Powerful, Non-Tarnishing
MicroClean™ ZE (RD-10) Immersion
UltraDeveloper (RDX-1076) Developer & Cleaner
FLEXCLEAN DM (RD-11) Spray or Immersion for Polymide
UniEtch (RD-84)
Microetch
Sodium Carbonate Photoresist Developer (RD-39) Eco. Dry Form
Etch
Photoresist Stripping
Alkaline Cleaners
Oxide
RESISTRIP L (RD-56) Long Life
Non-Tarnishing
FLEXCLEAN DM (RD-11) For Flex Circuits
ChemBond™ EC (RDZ-1601/1602) Oxide Replacement
Alternate Oxide for Laminate Adhesion
RESISTRIP™ EC-1 (RDZ-1590) Ultra Low Cost No VOC, Innerlayer Photoresist Stripper
MicroClean™ EC-3 (RDZ-1605) An Alkaline Spray Cleaner for Cleaning Copper Foils
Article originally appeared on RD Chemical Company - Manufacturing Chemists (http://rdchem.com/).
See website for complete article licensing information.
